- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/28 - Encapsulation, e.g. encapsulating layers, coatings
Patent holdings for IPC class H01L 23/28
Total number of patents in this class: 2123
10-year publication summary
|
165
|
140
|
163
|
210
|
182
|
178
|
130
|
148
|
97
|
16
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Murata Manufacturing Co., Ltd. | 22355 |
213 |
| Mitsubishi Electric Corporation | 43934 |
163 |
| STATS ChipPAC Pte. Lte. | 1516 |
96 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
87 |
| Rohm Co., Ltd. | 5843 |
70 |
| Intel Corporation | 45621 |
63 |
| Denso Corporation | 23338 |
44 |
| Infineon Technologies AG | 8189 |
39 |
| Texas Instruments Incorporated | 19376 |
38 |
| Samsung Electronics Co., Ltd. | 131630 |
34 |
| Panasonic Corporation | 20786 |
34 |
| Micron Technology, Inc. | 24960 |
32 |
| Advanced Semiconductor Engineering, Inc. | 1546 |
30 |
| Fuji Electric Co., Ltd. | 4750 |
25 |
| Shindengen Electric Manufacturing Co., Ltd. | 774 |
21 |
| Renesas Electronics Corporation | 6305 |
20 |
| Hitachi Automotive Systems, Ltd. | 3970 |
19 |
| Sony Semiconductor Solutions Corporation | 8770 |
18 |
| Amkor Technology Singapore Holding Pte.ltd. | 555 |
17 |
| Siliconware Precision Industries Co., Ltd. | 489 |
16 |
| Other owners | 1044 |